The 71st JSAP Spring Meeting 2024

Symposium : 【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

Symposium (Oral)

[22p-71A-1~8]【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

Fri. Mar 22, 2024 1:30 PM - 5:30 PM JST
Fri. Mar 22, 2024 4:30 AM - 8:30 AM UTC

71A (Building No. 7)

Keizo Kinoshita(AIO Core), Noriaki Matsunaga(Applied Materials Japan)

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