Presentation Information
[8a-P06-3]Fabrication of 20 nm Through-Hole Vias by Reactive Ion Etching for Solid-State Au Nanopore DNA Sequencers
〇Hiiro Yoshimasa1, Onozawa Yoh1, Seiichiro Izawa1, Yutaka Majima1 (1.Science Tokyo)
Keywords:
semiconductor,nanopore
Nanopore DNA sequencing has garnered significant attention in recent years. The protein-based nanopores, though widely used, suffer from limited mechanical stability. In this study, through-hole vias were fabricated to construct robust gold nanopores suitable for solid-state nanopore DNA sequencing.
Specifically, we have successfully fabricated 20 nm through-hole vias using electron beam lithography, reactive ion etching, and anisotropic etching.
Specifically, we have successfully fabricated 20 nm through-hole vias using electron beam lithography, reactive ion etching, and anisotropic etching.