[8a-P09-1~4] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

English Presentation

[8a-P09-3] Single accelerator systems for Cu microvia superfilling under pulse-reverse electrodeposition

〇(D)Huiju Seo¹, Myung Jun Kim², Jae Jeong Kim¹ (1.Seoul National Univ., 2.Sungkyunkwan Univ.)

Keywords:

Cu electrodeposition,Accelerator,pulse-reverse electrodeposition

As interconnect scaling reaches its physical limits, advanced packaging has gained increased importance. This study explores a single-accelerator system under pulse-reverse plating as an alternative to conventional multi-additive methods in Cu microvia meatallization process. Two accelerators were compared in terms of their ability to induce bottom-up filling, with attention to differences in CuCl-mediated adsorption behavior. While SPS enables bottom-up filling within a narrow concentration range due to its linear behavior, the new accelerator demonstrated a distinct mechanism, superior bath stability, and improved film quality. These results offer practical insights for the development of simplified additive systems in PCB manufacturing.