Session Details
[8a-P09-1~4]13.5 Semiconductor devices/ Interconnect/ Integration technologies
Mon. Sep 8, 2025 9:30 AM - 11:30 AM JST
Mon. Sep 8, 2025 12:30 AM - 2:30 AM UTC
Mon. Sep 8, 2025 12:30 AM - 2:30 AM UTC
P09 (Gymnasium)
[8a-P09-1]Nanotwinned Copper Formation Technology Using Inorganic Additive-Induced (111) Crystal Orientation
〇(DC)SooWoong Park1, Jaejeong Kim1 (1.Seoul National Univ.)
[8a-P09-2]Oxide-Based and Electroless Cu seeding on Glass Substrates Enabled by Liquid Phase Deposition
〇(D)Jiseok Lee1, Taeho Lim2, Jae Jeong Kim1 (1.Seoul National Univ., 2.Soongsil Univ.)
[8a-P09-3]Single accelerator systems for Cu microvia superfilling under pulse-reverse electrodeposition
〇(D)Huiju Seo1, Myung Jun Kim2, Jae Jeong Kim1 (1.Seoul National Univ., 2.Sungkyunkwan Univ.)
[8a-P09-4]Bake time-dependence of resistive change device using Cu-containing PVA film
〇Yuji Iwasawa1, Yuito Makishima1, Koga Nakamura1, Ryota Kobayashi1, Hiroki Nagai1, Shinya Aikawa1 (1.Kogakuin Univ.)