Presentation Information

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)

[8p-N202-4]Photonic wire bonding using developed high-refractive-index polymer material fabricated by dip-in laser 3D lithography

〇Lixin Xiang¹, Sho Okada², Katsunori Nishiura³, Takuo Shikama³, Shu Nagamatsu¹, Towa Maekawa¹, Kensuke Otsuka³, Tomohiro Amemiya¹ (1.Science Tokyo, 2.NICT, 3.Mitsui Chemicals, Inc)

Keywords:

high refractive index polymer material,dip-in 3D laser lithography,Photonic wire bonding

In this study, we developed a high-refractive-index (n = 1.65) photocurable polymer for printed wiring board (PWB) applications using a dip-in femtosecond-laser 3D direct-writing technique. Aiming at integration into next-generation co-packaged optics (CPO) that link multi-core fibers to silicon photonic chips, we evaluated the optical propagation characteristics of polymer waveguides: single-mode transmission was confirmed for a 2.8 µm-diameter circular waveguide embedded in an SU-8 cladding. We also fabricated bridge-type PWBs 300–500 µm long and successfully produced circular waveguides with a diameter of 2.8 µm extending over 100 µm.

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