Presentation Information
[9a-P07-8]Fabrication of bulk diamond thin structure using vertical and horizontal RIE for temperature wide-field imaging
〇(M2)Hiroki Tsuchiya1,2,4, Yuma Itabashi1,2, Koki Imuta1,2,4, Hideyuki Watanabe4, Satomi Ishida3, Hidetsugu Matsukiyo3, Masao Nishioka3, Satoshi Iwamoto3, Junko Ishi-Hayase1,2 (1.Keio Univ, 2.Keio CSRN, 3.RCAST U-Tokyo, 4.AIST)
Keywords:
Reactive ion etching,bulk diamond,temperature imaging
To achieve highly sensitive temperature imaging using NV centers, we fabricated a bulk diamond thin-plate structure with a thickness of 0.5 µm by combining vertical and horizontal reactive ion etching. This structure enables high spatial resolution and wide-area measurement, allowing precise two-dimensional temperature mapping while suppressing the effects of thermal diffusion. In the future, it is expected to contribute to the advancement of quantum sensors and to the evaluation of temperature distributions in integrated circuits.