[9p-N306-1~11] 3.6 Laser processing

1:30 PM - 2:00 PM JST(4:30 AM - 5:00 AM UTC)

[9p-N306-1] Ultra-high-speed and high-aspect-ratio laser drilling by combining Bessel beam with TSL processing

Yanming Zhang¹, Takumi Koike¹, Reina Yoshizaki¹, Guoqi Ren¹, Akihiro Shibata², Sota Kiriake¹, Ryota Hasegawa¹, Ikuo Nagasawa², Keisuke Nagato¹, Naohiko Sugita¹, 〇Yusuke Ito¹ (1.Univ. Tokyo, 2.AGC)

Keywords:

glass,laser processing,picosecond laser

Glass substrates are expected to play a key role in next-generation semiconductors. However, due to the inherent hardness and brittleness of glass, precise processing remains extremely challenging. In this study, we demonstrate that combining our previously developed Transient and Selective Laser (TSL) processing method with a Bessel beam enables ultrafast machining at a rate 1,000,000 times faster than conventional techniques. Using this method, we successfully formed through-holes with a diameter of 3 µm in 1 mm-thick glass substrates within just 20 µs.