[9p-N306-1~11] 3.6 Laser processing

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)

[9p-N306-3] Laser processing of dielectrics using extremely short pulses generated by a Yb-based femtosecond laser

〇(M1)Konosuke Kawanaka¹, Haruyuki Sakurai¹, Shotaro Kawano¹, Bo-Han Chen², Ching-Yu Hsieh², Jia-Xuan Su², Shang-da Yang², Kuniaki Konishi¹ (1.The Univ. of Tokyo., 2.National Tsing Hua Univ.)

Keywords:

Ultrafast Laser Processing,Dielectric,Multiple Plate Compression

In this study, we performed dielectric material processing using highly stable sub-10 fs pulses generated by combining a high-power Yb-based femtosecond laser with a multi-plate continuum system. We evaluated the characteristics of laser processing by comparing the results obtained with longer pulse durations. SEM observations revealed that reducing the pulse duration from 230 fs to 20 fs dramatically improved the processing quality, and a further reduction to 9 fs led to even greater uniformity in the ablation holes.