[17p-K306-1~11] FS.1 Focused Session "AI Electronics"

1:30 PM - 2:00 PM JST(4:30 AM - 5:00 AM UTC)

[17p-K306-1] [INVITED] Ultra-compact photonics integrated circuit for telecommunication and sensor applications using silicon photonics technology

〇Hideki Ono¹, Yosuke Onawa¹, Masanori Itoh¹, Shin Arahira¹, Akihiro Fujii¹, Naoki Minato¹, Masahiro Sarashina¹, Masayuki Kashima¹, Daisuke Shimura¹, Hitoshi Murai¹ (1.OKI)

Keywords:

silicon photonics,optical access communication,laser Doppler vibrometer

This paper reports on our efforts to develop silicon photonic integrated circuit chips for high-capacity optical access communications and various optical sensing applications, which support big data collection required by AI. For high-capacity optical access communication, the optical processing part of optical transceivers for single-core bi-directional optical access networks is implemented within a photonic integrated chip. For optical sensing, the optical system of a laser Doppler vibrometer is realized within a single photonic chip.