Presentation Information

[10a-E218-10]Investigation of Fiber Bundle Configuration in an Optical-Interference Contactless Thermometry (OICT) System Using a Fiber-Optic Bundle

〇Taiyo Yagi1, Harumu Ono1, Jiawen Yu1, Hiroaki Hanafusa1, Seiichiro Higashi1 (1.Hiroshima Univ.)

Keywords:

semiconductor,tempareture measurement