[10p-E215-1~15] CS.10 Code-sharing session of 6.5&7.5

5:30 PM - 5:45 PM JST(8:30 AM - 8:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[10p-E215-15] Characterization of Chemical Bonding Features at the Ti/Silica Glass Interface via HAXPES

〇Yuki Imai¹, Kotaro Ozaki¹, Katsunori Makihara^1,2 (1.Nagoya Univ., 2.IHP GmBH)

Keywords:

HAXPES,Package Substrate