Presentation Information
[10p-E310-2]Low-Temperature Plasma for Semiconductor Processing: Challenges and Outlook
〇Kenji Ishikawa1, Hajime Sakakita2 (1.Nagoya Univ., 2.Meijo Univ.)
Keywords:
Plasma etching,Atomic layer processing,Low-temperature plasma
Low-temperature plasma is a key enabling technology for realizing high-aspect-ratio (HAR) structures, which are essential in semiconductor manufacturing. In next-generation devices requiring atomic-scale control, there is a strong demand to shift from empirical recipe development to process design based on scientific understanding. Plasma processing can be understood as a hierarchical system consisting of gas-phase generation of reactive species, transport through boundary layers and microstructures, and surface reactions.Major challenges include precise control of species transport in HAR structures, improvement of material selectivity, and reduction of process-induced damage. Addressing these issues requires process designs that decouple reaction and transport based on physical understanding. In addition, data-driven approaches integrating diagnostics, simulation, and machine learning are essential for predictive process design.Furthermore, achieving both energy efficiency and environmental sustainability is critical. Advances in these areas are expected to enable sustainable, high-performance semiconductor manufacturing.