[10p-F211-1~8] Interfacial Nanoelectrochemistry for Next-Generation Semiconductor Strategies - From Geopolitics to Advanced Wet Processing -

3:00 PM - 3:15 PM JST(6:00 AM - 6:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[10p-F211-4] Numerical Simulation of Liquid Replacement during Single-Wafer Cleaning Using an Impinging Jet

〇(D)Makoto Miwa¹, Jukiya Ikegaya², Tomoya Nishi³, Toshiyuki Sanada⁴ (1.GSST, Shizuoka Univ., 2.GSIST, Shizuoka Univ., 3.Ebara Corp., 4.Shizuoka Univ.)

Keywords:

semiconductor cleaning,liquid replacement,numerical simulation

In wafer cleaning, rapid replacement of the initial liquid film, such as reacted chemicals and CMP slurry, with freshly supplied cleaning solution is essential. In this study, numerical simulations were conducted for single-wafer cleaning using an impinging liquid jet, employing an OpenFOAM-based method that prevents non-physical concentration distribution near the gas–liquid interface. Evaluation of the liquid replacement time and its governing mechanisms revealed that liquid replacement over the entire wafer is primarily driven by advection, whereas diffusion becomes the rate-limiting process for liquid replacement to extremely low concentrations near the wafer surface.