[10p-S1-1~20] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

5:15 PM - 5:30 PM JST(8:15 AM - 8:30 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[10p-S1-14] Visualization and Assessment of Strength Degradation at the Edge Region in Wafer Bonding

〇(M1)Ryuki Kusakabe¹, Ryota Ogata¹, Hyuga Ishii¹, Shumpei Murakami¹, Marie Sano¹, Fumihiro Inoue¹ (1.YOKOHAMA Nat. Univ.)

Keywords:

Wafer Bonding,Nanoindentation test