[10p-S1-1~20] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

5:30 PM - 5:45 PM JST(8:30 AM - 8:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[10p-S1-15] Estimation of Chemical Bonding States at Direct Wafer Bonding Interfaces
Based on Delamination Behavior

〇(M1)Shumpei Murakami¹, Kusakabe Ryuki¹, Ogata Ryota¹, Ishii Hyuga¹, Kitagawa Hayato¹, Inoue Fumihiro¹ (1.YOKOHAMA Nat. Univ.)

Keywords:

Wafer Bonding,Double Cantilever Beam test