[10p-S1-1~20] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

6:00 PM - 6:15 PM JST(9:00 AM - 9:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[10p-S1-17] Study of the Underfill with Negative Thermal Expansion Filler for Suppressing Thermal Stress due to CTE Mismatch in 3D ICs

〇Ruobo Lan¹, YIQING XU¹, HISASHI KINO¹ (1.Kyushu Univ.)

Keywords:

Underfill,Negative Thermal Expansion