[10p-S1-1~20] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

6:45 PM - 7:00 PM JST(9:45 AM - 10:00 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[10p-S1-20] Fabrication and Characterization of Indium Wires for 3D Packaging of Quantum Computer

〇Yuki Sakamoto¹, Yuji Kato¹, Sota Koyama¹, Hiroki Nakamura¹, Hisashi Kino³, Takafumi Fukushima^1,2, Tetsu Tanaka^1,2 (1.Grad. Sch. of Eng., Tohoku Univ., 2.Grad. Sch. of Biomed. Eng., Tohoku Univ., 3.Grad. Sch. of ISEE, Kyushu Univ.)

Keywords:

semiconductor,quantum computer,interconnects

This study focuses on indium (In) as a promising material for 3D interconnects toward quantum computer implementation. In wire test element groups (TEGs) were fabricated using sputtering and electroplating methods. To investigate the impacts of these deposition methods, their microstructures and electrical properties were evaluated through grain size observation using techniques such as SEM and electrical resistance measurements using the Kelvin method.