[11a-PB1-1~31] 13.7 Compound and power devices, process technology and characterization

[11a-PB1-29] Surface Planarization and Surface Evaluation of SiC Wafers Using Near-Field Etching

〇Reo Yoshimatsu¹, Kyohei Yoshida², Shoji Nagaoka^2,3, Makoto Takafuji¹ (1.Faculty of Advanced Science and Technology, Kumamoto Univ., 2.Kumamoto Industrial Research Inst., 3.Kumamoto Innovative Development Organization, Kumamoto Univ.)

Keywords:

SiC,Coherent Phonon,Optical Near-Field