[11p-A24-1~6] 3.6 Laser processing

3:00 PM - 3:15 PM JST(6:00 AM - 6:15 AM UTC)

[11p-A24-5] Internal modification of 4H-SiC by femtosecond laser double-pulses

〇(M2)Yuki Yamamoto¹, Yasuhiko Shimotsuma¹ (1.Kyoto Univ.)

Keywords:

femtosecond laser,SiC,laser slicing