[8p-E310-1~7] Strategic Fab Operations: A New Foundation for Next-Generation Device Realization

4:55 PM - 5:35 PM JST(7:55 AM - 8:35 AM UTC)

[8p-E310-6] Accelerating Next-Generation Semiconductor Manufacturing through Design-Manufacturing Co-Optimization: Advanced Process Manufacturing and Chip Design Bridged by AI Agents

〇Koki Tsurusaki¹ (1.Rapidus Corporation)

Keywords:

Short turn around time,ML/AI (Machine Learning and Artificial intelligence),LSI design environment

To maximize PPA and minimize Time to Market in the 2nm generation and beyond, it is essential to establish a deep collaboration between design and manufacturing that accounts for volume Fab control technologies. Based on our advanced Fab, which achieves ultra-short turnaround times (TAT) through a fully automated single-wafer transport system, this presentation introduces Raads (Rapidus AI-Agentic Design Solution) for optimizing turnaround time during the design phase, alongside our DMCO (Design-Manufacturing Co-Optimization) strategy that feeds manufacturing data back into design. Finally, we will discuss our vision for the next-generation semiconductor ecosystem.