Presentation Information
[8p-PB1-13]Uniform target utilization by a rotating multi-ring-shaped RF magnetron sputtering plasma
〇Masato Komori1, Ohtsuy Yasunori1 (1.Saga Univ.)
Keywords:
magnetron sputtering,target utilization,plasma
In recent years, the demand for advanced semiconductor devices has increased due to the widespread adoption of generative AI and the advancement of digital transformation (DX). In magnetron sputtering, which is widely used in semiconductor manufacturing processes, low target utilization remains a significant issue. In this study, a novel multi-ring magnet configuration was proposed to improve target utilization. By reducing the spacing between magnets, eight small magnetron plasmas were generated. The effects of the proposed configuration on magnetic field distribution, plasma characteristics, and copper target erosion profiles were investigated and compared.