[9p-E208-1~11] 7.3 Micro/Nano patterning and fabrication

4:00 PM - 4:15 PM JST(7:00 AM - 7:15 AM UTC)

[9p-E208-10] Residue-Free UV-NIL Using a Photoresist Containing Silver Nanoparticles, and Conductivity Evaluation of the Transferred Pattern

〇(M2)Takumi Ashida¹, Jun Taniguchi¹ (1.Tokyo Univ. of Scie.)

Keywords:

UV-NIL,Silver Nanoparticle Photoresist,Selective UV-NIL

In this study, we propose a method for forming circuit patterns using UV-NIL with a photoresist containing silver nanoparticles. Furthermore, we propose a process in which a mold with a light-shielding layer formed on the protrusions is used during UV-NIL, allowing the residual film to be removed during development, and we evaluate the shape and conductivity of the circuit patterns.