Presentation Information

[9p-E215-18]Atomic Layer Deposition of Ultrathin Alumina Films on 2D Oxide Nanosheets

〇(M1)Yuiki Uejima1, Wataru Sugimoto2, Ryo Nouchi1 (1.Osaka Metropolitan Univ., 2.Shinshu Univ.)

Keywords:

two-dimensional materials,dielectric film fabrication,conformal growth

Atomic layer deposition (ALD) enables the fabrication of uniform, ultrathin dielectric films; however, achieving conformal growth of such films on chemically inert two-dimensional materials remains challenging. Although surface oxidation treatments that promote surface nucleation can damage the material, we have previously demonstrated successful ALD growth on native-oxide-forming TaS2 without any O2 plasma treatment. In this talk, we report that conformal ALD growth of ultrathin alumina films is also feasible on two-dimensional oxide RuO2 nanosheets without intentional O2 plasma treatment.