[15a-70A_101-1~7] Atomic Layer Process (ALP) analysis and application technologies (3)

10:50 AM - 11:20 AM JST(1:50 AM - 2:20 AM UTC)English Presentation

[15a-70A_101-5] Ultra-High Aspect Ratio Test Structures in ALP Process Analytics

〇Mikko Utriainen¹ (1.Chipmetrics Ltd)

Keywords:

High Aspect Ratio,conformal film,PillarHall

Advanced 3D semiconductor architectures impose stringent requirements on atomic layer processing (ALP), including ALD, ALE, and area-selective deposition, particularly in features with aspect ratios far exceeding 100. This work demonstrates ultra-high aspect ratio lateral test structures as a sensitive analytics platform for ALP. With effective aspect ratios above 1000, these structures reveal penetration depth, film-ending behavior, and front evolution that are invisible on blanket wafers. The approach enables early detection of process drifts, supports ALE and ASD evaluation, and can be integrated into wafer-level pocket formats for practical production monitoring.