Presentation Information
[15a-PA5-16]Evaluation of dielectric breakdown characteristics of thin-film resistors using the finite element method Ⅱ
〇Yuki Takahasi1, Junya Arakawa2, Keita Izawa2, Toshiki Kanamoto1, Ryosuke Watanabe1 (1.Hirosaki Univ., 2.Nikkohm)
Keywords:
NiCr,Thin-film resistors,finite element method
In this study, we evaluate the insulation breakdown characteristics of industrial resistors under pulsed power application. The high-voltage thin-film resistors targeted in this research undergo an insulation withstand voltage test by applying AC voltage between the electrode and the flange (heat sink). However, occasional failures occur due to insulation defects, resulting in device destruction. Discharge occurs between the electrode and the flange, breaking the insulation, and discharge marks extend from the edge of the electrode to the edge of the insulating substrate. In this study, the cause of insulation breakdown in thin-film resistors was assessed through electric field analysis using the finite element method (FEM).