Presentation Information
[15p-PA3-11]Demonstration of fracture inspection method for micro semiconductor chips using oblique incidence laser measurement
〇(B)Ichigo Kitade1, Reo Terauchi1, Katsuhiro Mikami1, Kenichi Ikeda2, Yusuke Nakaminami2, Masanori Otake2 (1.Kindai Univ., 2.Opto Systems Co.,LTD.)
Keywords:
Laser Doppler Vibrometer,Principal Component Analysis,Oblique-Incidence Measurement
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