[17a-M_135-1~10] 1.3 Novel technologies and interdisciplinary engineering

11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)

[17a-M_135-9] Verification of Common Optical Bonding Processes in Co-Packaged Optics

〇Mirai Suzuki¹, Taro Itatani², Yuki Atsumi², Takeru Amano², Yoshinobu Okano¹, Satoshi Suda² (1.Tokyo City Univ., 2.AIST)

Keywords:

Co-Packaged Optics (CPO),Optical bonding,Optical interconnects

In co-packaged optics (CPO) technology, which enables next-generation data communication with high bandwidth and low power consumption, the optical bonding process is a key enabling technology. In this presentation, we focus on this common process in CPO and report experimental results obtained using a highly controllable model system based on face-to-face bonding of single-core fiber blocks.