Presentation Information
[17p-PB1-10]Fabrication of fully foldable devices using stress-separating structure
with ultra-flexible bonding
〇Takashi Okamoto1, Kazuma Nakajima1, Shogo Miyake1, Kazuki Yasugi1, Jiangfeng Wang1, Takafumi Uemura2, Tsuyoshi Sekitani2, Kenjiro Fukuda1 (1.Univ. Osaka, 2.SANKEN)
Keywords:
foldable,stress-separating,electronic device
Achieving complete folding has been challenging for conventional approaches due to material brittleness and stability issues. This study enables complete folding without relying on thinning by employing a stress-separating structure with ultra-flexible bonding technology, which separates the rigid area from the folding area. Through model experiments, we established design guidelines to prevent electrical disconnection and demonstrated packaging technology for highly reliable foldable devices.