Presentation Information

[17p-WL2_401-5]6-inch Wafer-scale fabrication of silicon passive components using UV nanoimprint lithography

〇(B)Yuki Nakayama1, Shu Nagamatsu1, Gai Ichisawa1, Towa Maekawa1, Risako Mori2, Yasushi Fujii2, Takahiro Asai2, Dai Shiota2, Kazuto Oonou3, Daiji Tanabe3, Nobuhiko Nishiyama1, Tomohiro Amemiya1 (1.Science Tokyo, 2.TOKYO OHKA KOGYO, 3.Tekscend Photomask)

Keywords:

silicon photonics,nanoinprint,UV-NIL

We demonstrated a 6-inch wafer-scale fabrication process for silicon photonic devices using UV nanoimprinting to facilitate widespread adoption. The waveguides, fabricated via full-wafer imprinting, exhibited uniform propagation losses of 1.62 to 1.81 dB/cm across the wafer. These results confirm excellent optical properties comparable to those achieved by electron beam lithography, demonstrating the viability of this technology as a low-cost, large-diameter process.