Presentation Information
[18a-M_123-8]Examination of Molecular Behavior at Epoxy/Silver Joint Interfaces via SFG Simulation
〇(M1)KOTARO KATSUMORI1, Misaki Ikeda1, Takayuki Miyamae1, Masaya Ukita2, Keisuke Wakamoto2 (1.Chiba Univ., 2.Rohm R&D Center)
Keywords:
Adhesion,Interface chemistry,Sum-frequency generation spectroscopy
Delamination at the epoxy/silver bonding interface after thermal reliability testing is a critical issue in power-conversion packages. In this study, we simulate SFG spectra of an epoxy/silver-oxide/silver multilayer using a thin-film interference model, and reproduce the peak inversion and intensity changes observed after long-term annealing at 150 °C by varying the silver-oxide thickness. This approach enables nondestructive estimation of molecular orientation at the buried interface and the growth of the oxide layer.
