[18p-WL1_201-1~7] Emerging research trends in thin-film materials, devices, and processes for future technological innovation

1:00 PM - 1:30 PM JST(4:00 AM - 4:30 AM UTC)

[18p-WL1_201-1] Single crystalline CoSn kagome metal thin films for interconnect applications

〇Tomoya Nakatani¹, Nattamon Suwannaharn¹, Rohit Dahule¹, Taisuke Sasaki¹, Ryoji Sahara¹ (1.NIMS)

Keywords:

interconnect,semiconductor,intermetallic compounds

Cu interconnects suffer from increased resistivity as dimensions shrink, degrading device performance. Anisotropic conductive materials with orientation-dependent resistivity are promising alternatives. CoSn kagome metal exhibits low resistivity along the c-axis and high anisotropy, making it a strong candidate for the interconnects for advanced process nodes. We fabricated single-crystalline CoSn thin films on MgO substrates and evaluated their growth behavior and resistivity anisotropy for interconnect applications.