Notice of additions and changes to tour facilities

Thank you for the numerous applications we received for the "3DPTec Integrated Center" tour. Due to the overwhelming number of applications this tour, which exceeded capacity, we have arranged a tour of "The University of Osaka, Joining and Welding Research Institute, Research Center for Additive Joining Application" instead.

Tour applications starting from today will be accepted for  the "The University of Osaka, Joining and Welding Research Institute, Research Center for Additive Joining Application" tour.

Furthermore, those who have already registered and wish to participate in the　"Research Center for Additive Joining Application" tour should contact taikai@jspm.or.jp.

Due to confirmation of the number of participants and the addition of tour locations, the registration deadline for the tour is May 11th (Monday).

"The University of Osaka, Joining and Welding Research Institute, Research Center for Additive Joining Application" tour is planned to include the following:

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■Date and Time: Wednesday, May 27, 2026, 15:00-17:00
■Location: The University of Osaka, Suita Campus, Joining and Welding Research Institute, Research Center for Additive Joining Application

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■Eligibility: Participants of the 2026 Spring Meeting
■ Participation Fee: Free of charge
■ How to Apply: Please apply through the meeting registration form.

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We sincerely look forward to your participation.