LPM 17: Laser Drilling and Cutting 2

8:50 AM - 9:10 AM JST(11:50 PM - 12:10 AM UTC)

[22-02] Percussion Drilling of Through Vias in Glass and Silicon Carbide Using Repetitive Single Pulses

*Bogusz Stępak¹, Natalia Grudzień¹, Rafał Smolin¹, Yuriy Stepanenko¹, Michał Nejbauer¹ (1. Fluence sp. z o.o. (Poland))

Keywords:

femtosecond laser,glass drilling,SiC,TGV

C000315