The 9th International Congress on Laser Advanced Materials Processing (LAMP2025)
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Session Details

LPM Oral PresentationLPM : LPM 17

LPM 17: Laser Drilling and Cutting 2

Thu. Jun 12, 2025 8:30 AM - 10:10 AM JST
Thu. Jun 12, 2025 11:30 PM - 1:10 AM UTC
Room 2(4F)
8:30 AM - 8:50 AM JST(11:30 PM - 11:50 PM UTC)

[22-01]Crackless percussion microdrilling of transparent materials by temporally shaping ultrafast laser pulses

*Guoqi Ren1, Huijie Sun1, Junya Hattori1, Keiichi Nakagawa1, Naohiko Sugita1, Yusuke Ito1 (1. The University of Tokyo (Japan))
8:50 AM - 9:10 AM JST(11:50 PM - 12:10 AM UTC)

[22-02]Percussion Drilling of Through Vias in Glass and Silicon Carbide Using Repetitive Single Pulses

*Bogusz Stępak1, Natalia Grudzień1, Rafał Smolin1, Yuriy Stepanenko1, Michał Nejbauer1 (1. Fluence sp. z o.o. (Poland))
9:10 AM - 9:30 AM JST(12:10 AM - 12:30 AM UTC)

[22-03]Advanced Femtosecond Pulse Laser Techniques for Battery Electrode Cutting: Strategies and Implications.

*Marie Fleureau1, Eric Audouard1, Quentin Mocaer1, Amina Arahouni2, Jean-Michel Romano2, Frédéric Mermet2 (1. Amplitude Laser (France), 2. IREPA Laser (France))
9:30 AM - 9:50 AM JST(12:30 AM - 12:50 AM UTC)

[22-04]Super-stealth dicing with nanometric precision

*Lei Wang1, Zhen-Ze Li2, Xin-Jing Zhao1, Wei Gong1, Qing Wang1, Wei-Wei Xu3 (1. Jilin University (China), 2. Tsinghua University (China), 3. Jilin Engineering Normal University (China))
9:50 AM - 10:10 AM JST(12:50 AM - 1:10 AM UTC)

[22-05]Ultrafast laser drilling through scattering fiberglass epoxy resin by tailored Bessel beams

*Pol Sopeña1, Nicolas Sanner1 (1. LP3 - CNRS/AMU (France))
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