LPM 22: Glass & Ceramic Prosessing 1

2:30 PM - 2:50 PM JST(5:30 AM - 5:50 AM UTC)Student presentation

[29-02] Predicting Stress Anomalies in Brittle Materials During Laser Thermal Cracking via Deep Learning and Photoelastic Imaging

*SHU-WEN YANG^1,2, Chin-Te Lin², Keiji Yamada¹, Ryutaro Tanaka¹, Katsuhiko Sekiya¹ (1. Hiroshima University (Japan), 2. National Central University (Taiwan))

Keywords:

Laser cleaving,Photoelastic Imaging,Deep Learning,Stress Anomaly Prediction,Conv-LSTM

C000257