Session Details

LPM 22: Glass & Ceramic Prosessing 1

Thu. Jun 12, 2025 2:00 PM - 3:30 PM JST
Thu. Jun 12, 2025 5:00 AM - 6:30 AM UTC
Room 1(4F)

[29-01]High precision polishing of glass using Gigahertz femtosecond lasers

*Jie Qiao1, Cyril Otieno1 (1. Chester F. Carlson Center for Imaging Science, Rochester Institute of Technology (United States of America))

[29-02]Predicting Stress Anomalies in Brittle Materials During Laser Thermal Cracking via Deep Learning and Photoelastic Imaging

*SHU-WEN YANG1,2, Chin-Te Lin2, Keiji Yamada1, Ryutaro Tanaka1, Katsuhiko Sekiya1 (1. Hiroshima University (Japan), 2. National Central University (Taiwan))

[29-03]Ablation mechanism and damage evaluation of SiCf/SiC composites under continuous-wave laser irradiation using high-speed X-ray imaging

*Yanming ZHANG1, Chaoran Wei1, Ryota Hasegawa1, Hiroto Motoyama2, Satoru Egawa2, Gota Yamaguchi3, Keisuke Nagato1, Naohiko Sugita1, Hidekazu Mimura2,3, Yusuke Ito1 (1. Graduate School of Engineering, The University of Tokyo (Japan), 2. Research Center for Advanced Science and Technology (RCAST), The University of Tokyo (Japan), 3. RIKEN SPring-8 Center (Japan))

[29-04]Experimental and numerical approaches to controlling CO2 Laser micro-ablation of fused silica glass: surface profile and heat-affected zone.

Luis A. Vazquez-Zuninga1, Christophe Galvan2, Jean-François Gleyze2, Philippe Cormont2, *Laurent Gallais1 (1. Institut Fresnel (Aix Marseille Univ, CNRS, Centrale Med) (France), 2. CEA CESTA (France))