The 9th International Congress on Laser Advanced Materials Processing (LAMP2025)
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Session Details

LPM Oral PresentationLPM : LPM 36

LPM 36: Micro-machining

Fri. Jun 13, 2025 1:30 PM - 2:50 PM JST
Fri. Jun 13, 2025 4:30 AM - 5:50 AM UTC
Room 3(4F)
1:30 PM - 1:50 PM JST(4:30 AM - 4:50 AM UTC)

[48-01]Simulation of hole shapes for percussion drilling processes with ultrashort laser pulses

*Philipp Bremer1, Joshua Farnschläder1 (1. Fraunhofer Institute for Laser Technology ILT (Germany))
1:50 PM - 2:10 PM JST(4:50 AM - 5:10 AM UTC)

[48-02]Investigation of Microhole Quality of Nickel-Based Single Crystal Superalloy (CMSX-4) Processed by Ultrashort Laser

*Dileep Madapana1, Srinivasa Rao Nandam2, Deepak Marla1 (1. Indian Institute of Technology Bombay (India), 2. Defence Metallurgical Research Laboratory (DMRL), DRDO (India))
2:10 PM - 2:30 PM JST(5:10 AM - 5:30 AM UTC)

[48-03]Laser inscription in semiconductors by multiphoton-initiated nanosecond mid-infrared pulse absorption

*Pol Sopeña1, Niladri Ganguly1, Gabriel Spühler2, Andrei Selivanau2, David Grojo1 (1. Aix-Marseille University, CNRS, LP3 (France), 2. Glucoloop AG (Switzerland))
2:30 PM - 2:50 PM JST(5:30 AM - 5:50 AM UTC)

[48-04]High-Sensitivity Ultra-Thin Glass Cantilever Sensor Fabricated by Femtosecond Laser Processing

*Yaxiaer Yalikun1,2, Yapeng Yuan3, Yang Yang3, Yoichiroh Hosokawa1,2 (1. Division of Materials Science, NARA Institute of Science and Technology (Japan), 2. Medilux Research Center, NARA Institute of Science and Technology (Japan), 3. Institute of Deep-Sea Science and Engineering (China))
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