Presentation Information

9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[Th1d-O31-03]Evaluation of the interface between Ag-saving low-temperature curing electrode paste using Ag-coated Cu particles and transparent conductive oxide film

*Takuya Minowa¹, Tappei Nishihara^2,3, Hyunju Lee^1,2, Yoshio Ohshita⁴, Kazuo Muramatsu⁵, Ogura Atsushi^1,2 (1. Meiji University (Japan), 2. MREL (Japan), 3. JASRI (Japan), 4. Toyota Tech. Inst. (Japan), 5. NAMICS Corp. (Japan))

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