[Th1d-O31] Sub area 3-1: Metallization

9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)

[Th1d-O31-03] Evaluation of the interface between Ag-saving low-temperature curing electrode paste using Ag-coated Cu particles and transparent conductive oxide film

*Takuya Minowa¹, Tappei Nishihara^2,3, Hyunju Lee^1,2, Yoshio Ohshita⁴, Kazuo Muramatsu⁵, Ogura Atsushi^1,2 (1. Meiji University (Japan), 2. MREL (Japan), 3. JASRI (Japan), 4. Toyota Tech. Inst. (Japan), 5. NAMICS Corp. (Japan))