Session Details

[Th1d-O31]Sub area 3-1: Metallization

Thu. Nov 14, 2024 9:00 AM - 10:30 AM JST
Thu. Nov 14, 2024 12:00 AM - 1:30 AM UTC
401(4F)
Session Chair(s):Nitin Nampalli(BT Imaging), Shota Suzuki(Toyo Aluminium)

[Th1d-O31-01 (Invited)]Silver paste reduction for TOPCon solar cells using a hybrid Cu and Ag screen printing metallization

*Pirmin Preis1, Jan Lossen1, Mertcan Comak1, Dominik Rudolph1 (1. ISC Konstanz (Germany))

[Th1d-O31-02]Screen printed copper contacts fired in air

*Thad Druffel1, Ruvini Dharmadasa1, Kevin Elmer1, Dustin Williams1, Erin Yenney1, Apolo Nambo1, Ajeet Rohatgi2, Ajay Upadhyaya2, Vijay Kumar2, Paul Stradins3, William Nemeth3, Steve Johnston3, Harvey Guthry3 (1. Bert Thin Films, Inc (United States of America), 2. Georgia Institute of Technology (United States of America), 3. National Renewable Energy Laboratory (United States of America))

[Th1d-O31-03]Evaluation of the interface between Ag-saving low-temperature curing electrode paste using Ag-coated Cu particles and transparent conductive oxide film

*Takuya Minowa1, Tappei Nishihara2,3, Hyunju Lee1,2, Yoshio Ohshita4, Kazuo Muramatsu5, Ogura Atsushi1,2 (1. Meiji University (Japan), 2. MREL (Japan), 3. JASRI (Japan), 4. Toyota Tech. Inst. (Japan), 5. NAMICS Corp. (Japan))

[Th1d-O31-04]Fabrication of Silver Coated Aluminum Powder for Next Generation PV Paste

*Yiyu Zeng1, Yajie Jiang1, Martin Green1 (1. University of New South Wales (Australia))