[C-10] Electron Devices

10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)

[C-10-02] Influence of wafer-level packaging on the heat dissipation and characteristics of InP-HBTs

〇Yusuke Araki¹, Yuta Shiratori¹, Fumito Nakajima¹ (1. NTT Inc.)

Keywords:

InP-HBT,WLP,sub-THz,thermal analysis