[P1-2vn] 18. Polymer

Japanese

[P1-2vn-17] Thermal conductivity calculation of epoxy-based thermosetting resin using molecular dynamics method

○Yuitsu Sugami¹, Teruki Tsurimoto¹, Kazuyuki Yahara¹ (1. SEKISUI CHEMICAL CO., LTD.)

Keywords:

Molecular Dynamics,Epoxy,Curing Reaction,Thermal Conductivity