Session Details
[Tu-3B]Rad-Hard Devices and High-Temp. ICs
Tue. Sep 29, 2026 2:00 PM - 3:50 PM JST
Tue. Sep 29, 2026 5:00 AM - 6:50 AM UTC
Tue. Sep 29, 2026 5:00 AM - 6:50 AM UTC
Oral-B(3rd Floor, G303+G304)
Chair:Sang-Mo Koo(Kwangwoon University, Korea), Mitsuaki Kaneko(Kyoto University, Japan)
[Tu-3B-01]Reliability of SiC Power Devices in Space and Atmospheric Radiation Environments
*Corinna Martinella1 (1. Institute of Electronics and Systems (IES) - University of Montpellier (France))
[Tu-3B-02]Effects of Cosmic Ray Irradiation on Commercial-Grade Silicon Carbide Power Devices
*Niamh Claire Arnold1, Virendra Malin Kotagama1,2, Arne Benjamin Renz1,5, Gabriel Scott Parkinson3, Kimmo H Niskanen4, James Gott5, Christopher Frost6, Maria Kastriotou6, Carlo Cazzaniga6, Peter Michael Gammon1,5 (1. School of Engineering, Univ. of Warwick (UK), 2. Radtest Ltd. (UK), 3. PEMC, Univ. of Nottingham (UK), 4. Accelerator Lab., Univ. of Jyväskylä (Finland), 5. Warwick Manufacturing Group, Univ. of Warwick (UK), 6. ISIS Neutron and Muon Source, Rutherford Appleton Lab. (UK))
[Tu-3B-03]Investigation of Microdose Effects on Device Characteristics of 4H-SiC Trench MOSFET under Heavy-Ion Irradiation
*Tomoya Kimura1, Takahiro Suzuki2, Eiji Kagoshima1, Kiyoka Yuge1, Tsuyoshi Nishiwaki1, Hirokazu Fujiwara1, Hiroyuki Shindou2 (1. MIRISE Technologies Corp. (Japan), 2. Japan Aerospace Exploration Agency (Japan))
[Tu-3B-04]Demonstration of Higher-Current 500 °C Durable 4H-SiC JFET Chips
*Philip Neudeck1, David Spry1, Robert Macdonald2, Robert Gossman2, Christopher Collazo-Davila2, Stacey Kennerly2, Liangyu Chen3, Carl Chang4, Mohamed Lababidi4, Sean McDarby5 (1. NASA Glenn Research Center (USA), 2. GE Aerospace (USA), 3. Ohio Aerospace Institute (USA), 4. HX5 LLC (USA), 5. E Street Technologies (USA))
[Tu-3B-05]Demonstration of 500°C non-volatile Memory of AlScN Ferroelectric Capacitors Controlled by SiC Lateral MOSFET
*Emad Andarawis1, Collin Hitchcock1, Lucy Broderick1, Robert Gossman1, Tammy Johnson1, Shubhodeep Goswami1, Mehrnegar Aghayan1, Brendan Hanrahan2, Daniel Drury2, Nastazia Moshirfatemi2 (1. GE Aerospace Res. (USA), 2. Army Res. Lab. (USA))
