Session Details
Plasma Science & Technologies-2
Wed. Mar 4, 2026 2:30 PM - 4:30 PM JST
Wed. Mar 4, 2026 5:30 AM - 7:30 AM UTC
Wed. Mar 4, 2026 5:30 AM - 7:30 AM UTC
Room B(N201)
Chair: Toshiyuki Sasaki(KIOXIA)
[04pB09I]Mesoscopic Modelling of Surface Kinetics
José Afonso1, *Vasco Guerra1, Pedro Viegas1 (1. Instituto de Plasmas e Fusão Nuclear, Instituto Superior Técnico, Universidade de Lisboa (Portugal))
[04pB10I]Bridging the Gap: From Fundamental Physics to Industrial Applications of Atmospheric Pressure Plasma
*Li-Chun Chang1,2 (1. Department of Materials Engineering, Ming Chi University of Technology (Taiwan), 2. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology (Taiwan))
[04pB11I]Cryogenic Atomic-Layer Processes Using Synergetic Reaction between HF and Plasma
*Shih-Nan Hsiao1, Makoto Sekine1, Yoshihide Kihara2, Ryutaro Suda2, Masaru Hori1 (1. Nagoya University (Japan), 2. Tokyo Electron Miyagi Ltd. (Japan))
[04pB12O]Effect of Plasma Conditions on Radical Sticking Probability in High-Aspect-Ratio Holes
*Takumi Kurushima1, Takayoshi Tsutsumi2, Makoto Sekine2, Kenichi Inoue2, Kenji Ishikawa2 (1. Nagoya University (Japan), 2. Center for Low temperature Plasma Sciences (Japan))
[04pB13O]Simulation of SiO2 Etching by HF Plasma with Coupled Calculation of Plasma and Surface Reaction
*Shigeyuki Takagi1, Fumihiko Matsunaga2, Shih-Nan Hsiao3, Yusuke Imai3, Makoto Sekine3 (1. Tokyo University of Technology (Japan), 2. PEGSUS Software Inc. (Japan), 3. Nagoya university (Japan))
