[Session 8] Ultrasonic Technologies 4

10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)

[4R105] Study on the Prevention of Particle Adhesion on Semiconductor Wafers Using Ultrasonic Vibration

Tomoya Masuda¹, Masaaki Miyatake¹, Yuki Kumagai², Hayato Hishinuma² (1. Tokyo University of Science, 2. Yamaha Robotics. Co.)

Keywords:

Ultrasonic vibration,Particles adhesion,Semiconductor wafers,Electrostatic neutralization,Manufacturing equipment