[20p-A202-1~11] Interfacial Nano Electrochemistry: Deepening semiconductor wet processing

1:00 PM - 1:30 PM JST(4:00 AM - 4:30 AM UTC)

[20p-A202-1] History and innovation of semiconductor cleaning equipment

〇Hiroyuki Araki¹ (1.SCREEN)

Keywords:

semiconductor cleaning equipment,history,innovation

From the late 1980's to 90's, the Si substrate size used shifted from 6 inches to 8 inches to 300mm. In the process, the batch cleaning method has also undergone 4 major changes. These methods are still used today. A new de-facto standard method has not been cleated. I would like to look back on the history of batch cleaning equipment, how the 90's changes were cleated, and send a message to the next generation.