Presentation Information
[20p-A202-7]30 Years of Semiconductor Cleaning Technology and Future Prospects
〇Hiroshi Tomita1 (1.KIOXIA)
Keywords:
semiconductor,clean,cleaning
From 1990 to 2020, semiconductor cleaning equipment introduced single-wafer spin cleaning in addition to batch-type immersion cleaning and the development of 300mm large-diameter wafers. In order to respond to the ultra-fine, highly stacked, and 3D three-dimensional nature of semiconductor devices, related companies are required to have advanced technologies such as 10 nm micro-defect control, ppt ultra-trace metal impurity control, and drying that prevents micro-pattern collapse. I would like to look ahead to what kind of technologies will be required for Japan's semiconductor liquid material process technology over the next 15 years.