Presentation Information

2:00 PM - 2:15 PM JST(5:00 AM - 5:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[20p-B201-3]TXV Formation Based on FOWLP with Pick-and-Place Cu-Pillar Assembly and Bendability Enhancement

〇(M1C)Atsushi Shinoda¹, Akihiro Tominaga², Hisashi Kino³, Tetsu Tanaka^1,3, Takafumi Fukushima^1,3 (1.Eng., Tohoku Univ., 2.Tohoku Univ., 3.Bio eng,. Tohoku Univ.)

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Keywords:

Flexible Hybrid Electronics,Fan-Out Wafer-Level Packaging

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