Presentation Information

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[20p-B201-4]RDL-first Wafer-to-Wafer Integration Technology for Hydrogel Flexible Hybrid Electronics (FHE) Device

〇Tadaaki Hoshi¹, Daichi DaichiNishiguchi², Hisashi Kino³, Tetsu Tanaka^1,3, Takafumi Fukushima^1,3 (1.Graduate School of Engineering, Tohoku Univ., 2.School of Engineering, Tohoku Univ., 3.Graduate School of Biomedical Engineering, Tohoku Univ.)

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Keywords:

Hydrogel

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