[21a-A302-1~12] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)

[21a-A302-5] Two-dimensional PIC-MCC Simulation of Capacitively Coupled Ar Plasma driven at 3 MHz

〇Kazuki Denpoh¹ (1.Tokyo Electron Technology Solutions Ltd)

Keywords:

capacitively coupled plasma,simulation,PIC-MCC

Two-dimensional discharge structures of an Ar CCP driven at 3 MHz are investigated using a PIC-MCC model. The gas pressure is on the order of Torr, which is typically used in PECVD and PEALD processes. The sheath electric field penetrates deeply inside the region between the top and bottom electrodes. Therefore, the plasma bulk and electron density oscillate significantly between the electrodes, resulting in a low plasma density. In contrast, a ring-shaped stationary bulk is formed at the outer periphery of the electrodes. The plasma density is relatively high since the loss of charged particles at the wall is suppressed.