[21p-A201-1~8] Renewed Challenge of Japan to Cutting-Edge Logic Technology

3:50 PM - 4:20 PM JST(6:50 AM - 7:20 AM UTC)

[21p-A201-6] The Revolution of Semiconductor Packaging in the Chiplet Era

〇Yasumitsu Orii¹ (1.Rapidus Corporation)

Keywords:

Chiplets,Semiconductor Packaging

Since the semiconductor cost for state-of-the-art nodes is increasing, "Chiplet" technology is in the spotlight as a new evolutionary path to scale up integration and improve performance and reduce the total cost. Chiplets are small IC dies with specialized functionality. Since chips must be connected in the shortest length while considering signal integrity and power integrity, the cutting-edge packaging technology is the key to improve the performance of IT equipments.